MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials for the production of printed circuit boards in Japan, Taiwan, Hong Kong, China, Thailand, and Europe. It offers various chemicals for electronic substrates, such as roughening type adhesion enhancement; rolled annealed copper roughening treatment; pre-lamination treatment of multilayer substrates and adhesion enhancement for high-frequency substrates; anisotropic etching and seed layer etching; copper surface treatment for CO2 laser direct drilling; degreasing, rust removal, and temporary anti-tarnish; other metal surface treatment; DFR pre-treatment; microetching; etch down; and various residue removal treatments. The company also provides AMALPHA, a metal surface treatment technology for direct metal and resin bonding. MEC Company Ltd. was incorporated in 1969 and is headquartered in Amagasaki, Japan.