Japan Pure Chemical Co.,Ltd. develops, manufactures, and sells precious metal plating chemicals for electronic components in Japan and internationally. The company provides gold electrolytic plating formulation for semiconductor applications, as well as PWB, connector, contact, and soldering applications; strike gold plating formulation for lead frame applications; flash gold plating formulation for leadframe uses; and palladium electrolytic formulation for connector and lead frame uses. It also offers gold plating formulation for soldering and wire bonding; electroless palladium plating formulation for wire bonding and soldering uses; and electrolytic and electroless silver plating formulations. In addition, the company provides anti bacterial agents for plating tanks and drag-out tanks; and impurity removal resin that removes Cu ions dissolved in Au and palladium plating formulation. Additionally, it offers surface treatment chemicals and stripping agents. Japan Pure Chemical Co.,Ltd. was founded in 1971 and is based in Tokyo, Japan.